NOTICE

When taking pictures, please select the CPU platform you need in the color classification

115X platform: CPU for INTEL 1150 1151 1155 1156 1200 architecture with metal backplane

1366 platform: If the 1366 motherboard itself has a fixed backplane, it can be ordered directly.If your motherboard does not have a backplane base with a fixed radiator, you can contact customer service to order a backplane base for the 1366 platform, or recommend a radiator with a backplane base that can be used! ! !

The2011 platform is divided into two types: square hole distance 80*80mm and rectangular hole distance 56*94mm. Please confirm the heat sink hole distance suitable for your motherboard, so as not to be unavailable after purchase, please contact customer service if you do not understand!

In addition, all 2011 motherboards on the market have backplane bases with fixed heat sinks! we do not have. If your motherboard does not have a backplane base with a fixed radiator, you can contact customer service to order a backplane base for the 2011 platform, or you can contact customer service to recommend a radiator with a backplane base that can be used! ! !

COOLSERVER R63 4 Heatpipe 2U Server CPU Cooler Workstation Computer Cooling Fan for Intel LGA2011 1700 115X AMD AM4 radiator workstation computer cooling fan

Product model: LGA1700-R63
CPU type: LGA1700 (square motherboard)
Voltage: 12V
Product size 90mm*90mm*67mm
Fan speed: PWM 2600-8000RPM
Noise value: 52.50dBA (MAX)
Air volume: 47.20CFM (MAX)
Fan Plug: 4pin PWM
Bearing type: double ball
Number of heat pipes: 4 heat pipes
CPU hole spacing: 78mm*78mm
Power consumption: 150W
Material: aluminum fins + 4 heat pipes

LGA2011-R63-3 Radiator
Product Model: LGA2011-R63-3
CPU type: LGA2011 (rectangular motherboard)
Voltage: 12V
Product size 104mm*79.5mm*67mm
Fan speed: PWM 2100-6800RPM
Noise value: 52.00dBA (MAX)
Air volume: 34.50CFM (MAX)
Fan Plug: 4pin PWM
Bearing type: double ball
Number of heat pipes: 4 heat pipes
CPU hole spacing: 94mm*56mm
Power consumption: 140W
Material: aluminum fins + 4 heat pipes

LGA2011-R63 Radiator
Product Model: LGA2011-R63
CPU type: LGA2011 (square motherboard)
Voltage: 12V
Product size 90mm*90mm*67mm
Fan speed: PWM 2100-6800RPM
Noise value: 52.00dBA (MAX)
Air volume: 34.50CFM (MAX)
Fan Plug: 4pin PWM
Bearing type: double ball
Number of heat pipes: 4 heat pipes
CPU hole spacing: 80mm*80mm
Power consumption: 140W
Material: aluminum fins + 4 heat pipes

LGA1156-R63 heat sink
Product Model: LGA1156-R63
CPU type: LGA1156 (square motherboard)
Voltage: 12V
Product size 90mm*90mm*67mm
Fan speed: PWM 2100-6800RPM
Noise value: 52.00dBA (MAX)
Air volume: 34.50CFM (MAX)
Fan Plug: 4pin PWM
Bearing type: double ball
Number of heat pipes: 4 heat pipes
CPU hole spacing: 75mm*75mm
Power consumption: 130W
Material: aluminum fins + 4 heat pipes

AMD AM4-R63 Cooler
Product model: AMD AM4-R63
CPU type: AMD AM4
Voltage: 12V
Product size 99mm*82.7mm*67mm
Fan speed: PWM 2100-6800RPM
Noise value: 52.00dBA (MAX)
Air volume: 34.50CFM (MAX)
Fan Plug: 4pin PWM
Bearing type: double ball
Number of heat pipes: 4 heat pipes
CPU hole spacing: 90mm*54mm
Power consumption: 120W
Material: aluminum fins + 4 heat pipes

4 Heat pipe through FIN process Dual ball bearing temperature control fans For LGA 2011/115X series Support 1151/1155/1156/AMD/AM4 series /LGA 1700 series

Four composite heat pipes were used Better heat conduction ability, better excellent heat conduction and heat dissipation performance Four high efficiency heat pipes closely cover the CPU surface, greatly increasing the contact area, so that the heat is more efficient to the heat dissipation fin.

Adopt the fin-piercing and fin-fastening process

Between the radiator FIN and copper tube, the fin-penetrating manufacturing process is adopted, combined with the fin-fastening technology, to increase the surface heat dissipation area and stabilize the FIN spacing.

The FIN of the radiator adopts the button FIN technology, which can not only increase the firmness, but also keep the spacing of each FIN consistent, so that the airflow generated by the fan can pass through each FIN evenly and smoothly, thus reducing the wind cutting noise and enhancing the heat dissipation performance.

Base conducts heat quickly

The zero distance contact of the base facilitates the heat generated by the CPU to be transmitted around in the first time
Attach to CPU heating core, absorb and conduct every minute of heat in time

Aluminum fin heat dissipation module

Adopt pure aluminum interbody heat dissipation group design, can directly disperse part of the temperature, greatly improve the heat dissipation efficiency

Fan module 6025 is used

Imported Ic components, quiet, stable, strong wind, large air volume, fast and efficient heat dissipation
Unique fan blade design can effectively reduce the wind cutting sound generated by the fan blade.